Technical Specifications

Feature Specification
Model Puhui T962C
Type Infrared IC heater / bench reflow oven
Effective Soldering Area 400 × 600 mm (drawer size)
Rated Power ~2 500 W
Temperature Range 0 °C – 280 °C
Process Cycle / Time 1 – 8 min (depending on board & profile)
Preset Temperature Profiles Up to 8 memory-profiles (preheat → soak → reflow → cool)
Heating Method Infrared radiation + forced-air circulation
Power Supply / Voltage AC 110 V / 220 V (50/60 Hz)
Drawer Dimension / Unit Size Approx. 684 × 504 × 225 mm
Net Weight Approx. 25 kg
Application SMD/BGA rework, small batch production, prototyping